GIGABYTE Launches Latest AMD B550 AORUS Motherboards
Up to 16-Phase Digital Power Design Improves Quality and Performance
Taipei, Taiwan, July 21, 2020 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced the launch of the newest B550 AORUS motherboards primed to unleash the potential of 3rd Gen AMD Ryzen™ desktop processors. The all new B550 AORUS motherboards kick off the PCIe® 4.0 era with extensive feature sets, and equip up to Direct 16 phases of digital power design with advanced thermal solutions to provide the processors and chipset with a more stable power supplement.
“We are seeing increasing user demands for flexible systems that perform well in a multitude of tasks, from gaming to content creation, more than ever before,” said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. “AMD is excited to bring the power of 3rd Gen AMD Ryzen™ desktop processors and cutting edge PCIe® 4.0 support to the mainstream users with our latest AMD B550 chipsets. With overwhelming platform support from our partners at Gigabyte, AMD is confident these new B550 platforms will provide flexibility and power never seen before on a mainstream platform.”
The range of GIGABYTE B550 AORUS motherboards provide various power designs to fulfill different budgets and system configuration. Users can choose 10+3 phases, 12+2 phases DrMOS all digital PWM design, or go straight to the flagship model, B550 AORUS MASTER, to experience a maximum of 1120 Amps solid power supply from Direct 16 phases digital power design with each phase of Power stage capable of managing up to 70A. As for the Mini-ITX board fans, B550I AORUS PRO AX implements 6+2 phases of DrMOS digital power design at 90A per phase, maximizing the overclocking potential on the 3rd Gen AMD Ryzen™ desktop processors under different configuration while balancing the power efficiency and durability.
With a PCIe® 4.0 M.2 design, and users can experience lightning-fast read/write processes and data transfer speed of PCIe® 4.0 SSD through top-of-the line components with 3rd Gen AMD Ryzen™ desktop processors. The B550 AORUS MASTER integrates three PCIe® 4.0 x4 M.2 slots layout directly from the processor, allowing users to allocate the bandwidth between PCIe® and M.2 slots accordingly and even to build a NVMe M.2 SSD RAID 0 array which can achieve up to 12700MB/s in write speed, bringing the performance of PCIe® 4.0 VGA cards and SSDs into full play.
The advanced thermal design of the power supply is another focus point of the GIGABYTE B550 AORUS motherboards. As well as a multi-cut heatsink design, the B550 AORUS PRO motherboard and higher-spec models come equipped with Fins-Array Heatsinks with Direct Touch Heatpipe, enabling the strongest VRM cooling and stability while overclocking. The B550 AORUS MASTER takes this a step further with optimized heat dissipation of the thermal baseplate and I/O, and audio armor, achieving a fusion of stylish thermal design and remarkable performance.
GIGABYTE B550 AORUS motherboards provide a comprehensive connectivity of mainstream extension interfaces and are suitable for future upgrades. While the B550 AORUS series ATX and Mini-ITX motherboard provide 2.5Gbps Ethernet speeds, which are 2.5 times faster than Gigabit Ethernet, select GIGABYTE B550 AORUS motherboards also feature internal wireless connection. The B550I AORUS PRO AX and B550 AORUS MASTER motherboards boast Intel WiFi6 802.11ax wireless configuration with 2T2R high-gain antenna, delivering blazing fast 2.4Gbps connection speeds. With both high-speed Ethernet and wireless connection, users can have extra flexibility, optimized network efficiency, and reliability.
For more information and news on GIGABYTE products, please visit the official GIGABYTE website: http://www.gigabyte.com
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